Putty defects of atomic ash defects


The defects of putty in the construction process mainly include slow drying, difficult to polish, difficult to scrape, and delamination.

1. Slow drying

There are three reasons for the slow drying of atomic ash (related instrument: drying time Tester): one is caused by the improper proportion of curing agent; the other is caused by the low temperature or high relative humidity in the construction environment; the third is the product itself. It is caused by poor drying performance (drying index has not been reached). The slow drying caused by too little amount of curing agent can be solved by appropriately increasing the amount of curing agent during preparation. If the ratio of the original bucket ash to the curing agent is 100:1.5, slow drying may occur. If the ratio is 100:2.5, the scraped layer can be dried in about For slow drying caused by too cold weather or high relative humidity, it can be solved by increasing the construction environment temperature or improving the drying conditions. Generally, the putty and curing agent have a fast curing reaction at 20-30°C, and the coating is easy to dry in time, but the curing reaction is very slow at below 0°C. In order to make the coating dry in time, it can be baked and dried at a temperature of 50-60°C after scraping. For products with poor dryness of putty itself, it should be solved by low-temperature drying, increasing the amount of or adjusting the product.


2. Difficult to polish

The putty of qualified products has good sanding property after drying. For the putty that is difficult to polish, it is an abnormal phenomenon, and the manufacturer should adjust the formula to improve it.


3. Difficult to scratch

The putty of qualified products has good scraping property. Difficult to scratch, is an abnormal phenomenon. In this case, it should be improved by the manufacturer.


4. Delamination

Delamination mainly occurs during the baking process, and generally should not occur at room temperature. The reason is that some putty has poor baking resistance, and delamination is easy to occur when the temperature exceeds 100 °C. Therefore, in the baking construction, it is necessary to do a small sample baking experiment first, and then carry out construction baking according to the suitable temperature and time of the experiment to prevent delamination. Nevertheless, for the bake-dried coating, it should not be too thick (coating Thickness Gauge), in case the temperature is too high during baking and the curing reaction is too fast to cause the coating to peel off.


NBCHAO E-shop
Guess you like it
Relevant knowledge