Application of Pencil Hardness Tester in fixed abrasive polishing pad

Several scholars including Zhu Yongwei, Wang Jun, Li Jun and Lin Kui used pencil Hardness Tester and some test methods to analyze the influence of the components of the polishing pad on the swelling rate and dryness in the article "Exploration and Research on Polishing Silicon Wafers with Consolidated Abrasive Polishing Pads". Influence of wet hardness. This paper mainly extracts the excerpts from the paper to illustrate the role of the pencil Hardness Tester in the experiment. At present, few people in CHINA have been involved in the research in this field. This study explored the influence of the composition of the bonded polishing pad on its swelling rate and pencil hardness, and compared the removal rate of the bonded abrasive and the free abrasive to polish the workpiece and the polished workpiece. Surface roughness.