BGA (Ball Grid Array) is a packaging technology that is widely used in integrated circuit chips in modern electronic products and requires good high-low temperature resistance. The high-low temperature resistance test is to verify the reliability and stability of the BGA package. In a high-temperature environment, BGA may suffer from problems such as thermal expansion, fracture, and solder joint cracking, while in a low-temperature environment, BGA may be affected by cold brittleness, resulting in failure or damage. Through the high-low temperature resistance test, the stability and reliability of BGA packaging in different temperature environments can be evaluated, and high-quality integrated circuit packaging technology can be provided for the production of electronic products.
The high-low Temperature Test Chamber is also widely used in the high-low temperature resistance test of BGA (Ball Grid Array Packaging) to test the performance and stability of BGA in high temperature and low temperature environments to evaluate its scope of application and service life.
experiment procedure
(1) Place the BGA to be tested in a high-low Temperature Test Chamber, and adjust the temperature of the Test Chamber to a set high temperature value (eg 100°C).
(2) Keep the temperature stable for a period of time (such as 1 hour), and then adjust the temperature of the Test Chamber to the set low temperature value (such as -40°C).
(3) Keep the temperature stable for a period of time (for example, 1 hour), and then adjust the temperature of the Test Chamber back to the set high temperature value.
(4) Repeat the above process many times to test the performance and stability of BGA in the high-low temperature alternating environment.
(5) During the test, BGA parameters can be monitored and recorded, such as temperature, resistance value, capacitance value, etc.
(6) After the test is completed, evaluate the performance parameters and stability of the BGA to determine whether it meets the requirements for use.
NBCHAO reminds you: the high-low temperature test parameters and test standards of BGA may be different, and the specific test steps should be adjusted according to the product type and relevant standards. At the same time, sufficient safety measures need to be taken before the test to ensure that no safety accidents will occur during the test.
