Symptoms | reason | Countermeasures |
Plating is easy to burn | Copper content is too low Overcurrent The proportion of brightener is out of balance Bath temperature is too low Negative and anode too close Cyanide pollution | Copper Sulfate Supplement reduce current Adjust the rinse aid Appropriately increase the bath temperature Adjust the distance between cathode and anode Heat to 60°C to remove |
Poor binding | Improper handling of pre-plating primer Contaminated by impurities Surface passivation after immersion nickel preplating | Enhanced pre-plating Treat with activated carbon HCl activation |
The coating has burrs and is not easy to shine | Poor anode material Anode sludge or suspended solids Improper treatment before plating | Choose a good phosphorus copper plate Clean the anode, filter Check pre-plating treatment |
Poor coating dispersion ability (bright coating) | Copper too high, sulfuric acid too low not enough wetting agent Bath temperature is too high Brightener mismatch Current density is too low Excessive decomposition of organic matter, cloudy solution | Adjust ingredient content after analysis Add wetting agent Lower bath temperature Add H-1 and polyethylene glycol Appropriately increase the current density and cool down processing, filtering |
Poor brightness and leveling | light dose ratio imbalance Copper content is too low, acid radicals are too high high temperature, low current Excessive organic decomposition Insufficient wetting agent | Adjust the rinse aid Adjust ingredients after analysis Increase the current and cool down to the process range Treatment with hydrogen peroxide and activated carbon Appropriately add H-1 and C |
Plating with streaks and orange peel pitting | Too many or too few H-1s cloudy solution Too little anode area | Power up to handle or increase C Filtration Increase the anode area |
The upper and lower parts of the plated foggy parts have uneven brightness | The brightener is uneven in the tank not enough wetting agent short or insufficient anode Insufficient H-1 or S-2, S-1 | Thoroughly stir and filter the solution Add wetting agent Increase and solve in time after inspection Supplement H-1, S-1, S-2 as needed |
