A thermal shock chamber with uniform thermal stress performance developed to comply with major international thermal shock testing standards. Meeting international standards The TSD chamber can conduct various tests through major international standards such as MIL, IEC, and JIS.
Compatible test standards:
IEC 60749-25: Semiconductor equipment – Temperature cycling
IEC 60068-2-14 Na: Environmental testing – Temperature change
IEC 61747-5 Na: Liquid crystal and solid state display devices – Environmental, durability and mechanical test methods
MIL-STD-883: Military Standard, Microcircuits, Test Standard
IPC-TM-650 2.6.6: Temperature Cycling, Printed Wiring Boards
SAE J1879: Manual for Durability Verification of Semiconductor Devices in Automotive Applications
JASO-D902: Durability test method for automotive electronic equipment
EIAJ ED -4701: Environmental and Endurance Test Methods for Semiconductor Devices. (generally)
EIAJ ED-4702: Mechanical Stress Test Methods for Semiconductor Surface Mount Devices
EIAJ ED-7407: Environmental and Endurance Test Methods for CSP, BGA Packages Under Mounted Conditions
