Spin coating method and Meyer rod coating method are two common methods of film formation in experiments, so what is the difference between the working principles of the two?
spin coating method
The spin coating method is to adsorb the substrate on the turntable, drop an appropriate amount of solution on the substrate, adjust the homogenizer to the appropriate speed and time, and after starting the machine, the liquid on the substrate will be under the action of centrifugal force generated by high-speed rotation , evenly dispersed on the surface of the substrate, and form a thin film after the solvent in the solution evaporates completely. The spin coating method is simple and easy to operate, and the thickness of the film can be controlled by controlling the rotation rate, and the film is relatively uniform, but this method has requirements for the size of the substrate, and the bonding force with the substrate is weak.
Meyer rod coating method
The Meyer rod scraping method is a more commonly used method of film formation. It selects wire rods of different specifications and drips the solution onto the front end of the wire rod. After starting the film coating machine, the liquid will continue to move forward under the push of the wire rod. Coating until finally a film of uniform thickness is formed on the substrate. The remarkable feature of this method is that parameters such as the advancing speed, coating distance, and heating temperature can be controlled by the instrument, so that it is convenient to prepare a film with specific requirements. Dimensions of film and industrial mass production.
