Die Shear Test Overview
Die shear testing of epoxies, solders and sintered materials, etc.
Die Shear Test Method per MIL STD 883
Shear testing (adhesion testing) up to 200Kg and material testing up to 1000Kg
Self-Aligning Cutting Tool
Low profile shear for thin molds
Optional heating and cooling shear stages
Die shear testing is used as a process control method for semiconductor and related microelectronic devices to determine the connection to various substrate materials (e.g. metal leadframes, ceramic packages, PCB substrate, etc.
Die shear test parameters (test speed, tool height, etc.) are similar to those used for ball bond shear and are tested according to MIL STD 883.
The principle behind the die shear adhesion test is to use a wedge-shaped shear tool perpendicular to the top surface of the material and parallel to the longest edge of the die (if applicable). Self-aligning shearing tools ensure that the die remains parallel so the load is distributed as evenly as possible during shearing. The cutting tool should be at least as wide as the object being measured. The test object is then moved onto the shearing tool until the bonded interface or the test object fails (destructive testing), or a predefined force is reached (non-destructive testing).
Depending on the die attach and substrate material used, the bond strength can also decrease when exposed to higher and/or lower temperatures. Therefore, it is suggested that binding strength should also be measured and characterized as a function of temperature. A range of heated and cooled die shear tables are available to support testing at temperatures from -55 o C to 155 o C and ambient to 450 o C.
