Material Creep Testing Overview:
Apply a uniform load to measure interfacial creep
Testing material interfaces over time
Test material interface at set temperature (hot or cold)
Evaluate interface material and process variables
Precise alignment of test tool to material interface
The dimensional change over time that occurs when a material is statically loaded is called material creep.
Creep testing is performed by applying a fixed load (for example, a shearing tool to a semiconductor device) to a test sample. The position of the test tool relative to the sample is then recorded as a function of time, typically over time intervals lasting thousands to tens of thousands of seconds. The test stops when the sample fails, deforms beyond the set amount, or after the set time.
Creep measurements are important for solders, polymers, and adhesives because they experience large strains over time, and the strain rate is very sensitive to temperature. The applied stress can be well below the yield point, and in all cases the time-dependent deformation is due to the thermal activation process.
A system-dependent series of heating and cooling stages are available to support creep testing requirements.
