Stud pull test overview:
Stud Die Pull Test for Bonding Dies
Stud Pull Test Assemblies and Planar Substrates
Testing thin and brittle molds under tension
Apply a uniform force during the test
Compliment Die Shear Test
Destructive testing (since the stud sticks to the mould)
Stud pull testing is used as a process-controlled method to determine the adhesion of chips or other flat components and substrates and is ideal for fragile, thin, stacked or large area chips because the force is applied uniformly in pure tension to the component being tested.
This is accomplished by bonding a disposable stud to the top surface of the die and applying a perpendicular force away from the die bonding interface.
Stud pull testing is a complementary technique to the more common die shear testing, and both methods are used to gain insight into the strength of the die-to-substrate bond in many ways. Since the shear test applies its load on one edge of the test object, which can cause the chip or substrate to bend during the test, the stress state becomes a combination of shear and tension. This bowing becomes most severe as the die area increases relative to the die thickness. Stud pull testing eliminates this problem by distributing forces more evenly across the top surface
