Inside the jetting head, individual solder balls are dispensed to the bottom of a capillary, where the thermal energy of the laser melts the solder ball, allowing it to be jetted under pressurized nitrogen to any solder location that is immediately reflowing. The process is applicable to various solder alloys, all with different melting temperatures (SnPb, SnAgCu, SnAg, AuSn, InSn, SnBi...) and does not require flux. So it's a clean process.
The laser's localized heat and short pulse period ensure that minimal thermal stress is applied to areas other than the joining surface. The single-ball dispensing mechanism requires no tools for flexible soldering positions and non-contact soldering.
The advantages of this process are reduced thermal stress from localized heating and no mechanical contact with the substrate or delicate components such as MEMS.
The solder spray process can be used in a variety of applications such as discrete devices, probe cards, memories, camera modules, wafers, PCBs, flexible substrates, BGAs, CSPs, sensors and 3D components such as MEMS. Target markets include defense, medical, automotive and aerospace.
