Thermal shock chamber equipment is ideal for testing various properties of electronic components in a rapidly changing temperature environment. Many materials are now tested with this equipment. Before the Test Chamber is run, in order to make the test results of the equipment more accurate, it is actually necessary to clean the test piece. Are there any precautions when cleaning the specimen?
1. Cleaning the samples tested in the thermal shock chamber
Debris and dust on the test piece can be removed by cleaning. This accumulated dust may affect the test results of the object. When cleaning, pay attention to cleaning the surface of the test piece and other substances on it. Do not use tape during cleaning. corrosive substances.
Specimens can be cleaned with a clean soft brush or with an ultrasonic cleaning device and boiling hydrocarbons between 60°C and 120°C. Rinse with unused solvent, then wash to dry the sample.
Some samples with a protective organic film layer could not be cleaned or coated prior to testing in the thermal shock chamber, and if they were samples cut from large coated workpieces, they could not be cleaned or coated. Damage the overlay near the cut area to avoid confusion.
After cleaning the sample, the staff should cover the lid and other covers to avoid accidental contact with the contaminated sample and affect the detection effect.
2. What should I do after cleaning the specimen in the thermal shock chamber?
After cleaning the test piece, it can be placed in the thermal shock chamber. When placing samples, please pay attention to the placement position and material spacing. This is because the test equipment has a two-Cabinet-type and a three-Cabinet-type with different structures. The equipment requires the test pieces to be placed in the same position, and considering the heat dissipation problem, it is necessary to ensure that multiple test pieces are not packed too densely, and at the same time keep a distance from the inner wall of the equipment, which also facilitates the air circulation in the box and makes the entire test operation more procedural.
