YINUO YN-IBTFB interlayer bond strength Tester
YINUO YN-IBTFB Interlayer Bonding Strength Tester is used to detect the bonding strength between paper and Cardboard layers (between paper layers and layers, within paper), YN-IBTFB Interlayer Bonding Strength Tester Sample size 25.4mm × 25.4mm, test quantity 25.4 × 128mm, 5 groups of samples, test thickness (0.1~ 5) mm, Impact angle Standard Impact energy release angle 90 °.
YiNuo
YN-IBTFB
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Instrument Usage
YN-IBTFB Interlayer Adhesion Strength Tester|Connected to a computer is a testing instrument used to detect the interlayer bonding strength of paper and cardboard (between paper layers and within paper), which can be used to detect the internal bonding strength of sheet materials such as paper composites, film composites, etc.
Operating Principle
The instrument adopts the Scott type internal bond strength testing method, and its detection principle is as follows: the combination of double-sided tape-specimen-double-sided tape forms a sandwich structure, which is pressed between a metal flat anvil and an aluminum block. The pendulum is struck against the inner surface of the upper part of the aluminum block to flip the aluminum block and destroy the specimen in the Z direction. The energy absorbed during the destruction of the specimen is calculated by determining the highest position of the swing, expressed in J/m2.
Enforce the standard
GB/T 25203、ASTM T569 pm-00
Technical characteristics:
The whole machine has strong rigidity and stable structure, which avoids energy loss caused by vibration during the test;
Reliable specimen clamping and positioning, reducing the error caused by sample sampling;
The specimen pressure is read out directly from the pressure gauge;
The man-machine interface adopts digital display display, Chinese and English operating system;
It has a computer communication interface, which can communicate with the host computer software (purchased separately).
Standard configuration:
Host, 3.2in LCD display, imported encoder, custom fixture, built-in printer, power cord, intelligent control system, invention patent hydraulic system, manual, warranty card, printing paper, calibration weight
Practice:
| Basic application | Insulating paper | Interlayer adhesion strength test of electrical cardboard and electrically insulating cardboard |
| Bobbin paper | Test the strength of interlayer adhesion between paper tube paper, bobbin paper and kraft paper | |
| Gray cardboard | Interlayer adhesion strength test of various gray cardboard, cardboard, and composite cardboard | |
| paper jam | Test of interlayer adhesion strength of kraft cardboard, white card, and whiteboard paper | |
| Box | Interlayer adhesion strength test of color boxes, cigarette boxes, and packaging boxes | |
| Extend your application | other | Test of the interlayer adhesion strength of other industrial paper that needs to be processed |
YiNuo YN-IBTFB Interlayer bond strength TesterSpecifications
| LIST | VALUE |
|---|---|
| Specimen size | 25.4*25.4mm |
| Specimen size | 25.4*128mm |
| test thickness | （0.1~5）mm |
| Impact Angle | 90° |
| release method | Fully automatic release |
| Measurement range | A档：(0~500)J/m²；B档：(500~1000)J/m² |
| Error of indication | A档：±1J/m²；B档：±2J/m² |
| Instrument Accuracy | 0.01J/M2 |
| unit | J/M²、lbf/in² |
| Resolution | 0.001Lbf/in ², 8000 pulse high-precision encoder |
| Common sample pressure | (690±21)kpa (1034±34)kpa |
| Sample holding force | 0~400N (adjustable) |
| Sample pressure range | 0~65kg/cm²（0~950psi） |
| Primary pressure area | 12.72cm² |
| Parallel positioning of specimen holder | R=0.4×10 |
| Pressure arm ratio | 231.08：0.8 |
| Double-sided adhesive force | >486N/m |
| Display | 7.0In touch screen + connected computer control |
| printout | modular integrated thermal printer |
| Dimensions | 500*400*650mm |
| Weight | 70kg |
| number of samples | Group of 5 |
YiNuo YN-IBTFB Interlayer bond strength Tester Packing list
machine X1, manual X1, certificate X1, warranty card X1
[Note] Because the manufacturer's packaging may be updated or upgraded, the detailed packaging list shall be subject to the latest standard configuration of the manufacturer.
