YINUO YN-IBTF01 Microcomputer Interlayer bonding strength Tester 0~1000J

Instrument use

YN-IBTF microcomputer Interlayer Bonding Strength Tester is used to measure the internal bonding strength of various paper and cardboard materials according to TAPPI T569 and ISO 16260 methods. The instrument design is based on a falling pendulum, which produces a high velocity impact on a paper sample, which is sandwiched between two double-coated tape substrates. Pendulum impact measures the total energy required to separate the fibers inside the sample into two layers along the Z-shape direction. It is used to test the interlayer peeling strength of industrial paper such as electrical insulation cardboard, bobbin paper and gray cardboard. It is suitable for paper mills, scientific research institutions and quality inspection departments.

Principle

The Principle of the interlayer bonding Tester: the combination of double-sided tape-sample-double-sided tape forms a sandwich structure, which is pressed between a metal flat anvil and an aluminum block, and the inner part of the upper part of the aluminum block is hit with a pendulum. surface, turn the aluminum block over, and destroy the sample in the Z direction. Calculate the energy absorbed during the destruction of the sample by measuring the position of the swing, expressed in J/m2.

Executive standard

GB/T 25203, ASTM T569 pm-00, DIN ISO 16260, TAPPI-UM403

technical features

7.0in touch screen curve display, free switching between Chinese and English;

Hydraulic viscose pressure sample, the pressure can be automatically adjusted (patent);

It has the function of statistical processing of test data;

Special level 5 calibration tool set (optional);

The rigid structure of the whole machine is strong and stable, avoiding energy loss caused by vibration during the test process;

Reliable sample clamping and positioning, reducing the error caused by sample sampling;

Optional connection to a computer to automatically draw real-time test data curves (optional)

product configuration

Application

host X1, manual X1, certificate X1, warranty card X1

[Note] Because the manufacturer's packaging may be updated or upgraded, the detailed packaging list shall be subject to the latest standard configuration of the manufacturer.