PUSHEN TQC Manual Cupping Tester Laboratory cupping testing device
Height display digits 00.00mm, height display indexing 0.01mm, the use of side rocker lifting spherical head, more stable operation; LCD display, boot can be used, the test plate is not conductive requirements do not need each boot zero.
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Introduction
The principle is to press the test plate from the top with a fixed ring with holes, and then push the spherical head against the test plate from bottom to top at a slow speed, so that the test plate forms a hemispherical convex deformation in the middle of the fixed ring; through a magnifying glass Visually observe whether the convex test plate cracks or detaches from the substrate, and uses the convex height when cracking or detachment from the substrate initially occurs as the evaluation index. The operation surface adopts an inclined layout for easy observation; the side rocker is used to lift and lower the spherical head, making the operation more stable; the display uses an LCD, which simultaneously displays the cupping value (current maximum lifting value) and the shaking value (using positive and negative values ââto indicate the current position of the head) ; It can be used immediately after powering on. There is no requirement for the test plate to be conductive and there is no need to calibrate the zero every time it is turned on. It is also possible to step back during the lifting process and then continue to lift.
Standards compliant
| GB/T | 9753 |
| ISO | 1520 |
Pushen TQC Cupping TesterSpecifications
| LIST | VALUE |
|---|---|
| input Voltage | 220V AC 50Hz |
| Head steel ball diameter | 20mm |
| Maximum jacking height | 10mm |
| height display digits | 00.00mm |
| Height display indexing | 0.01mm |
| Height display Accuracy | 0.05mm |
| Shaker jacking speed | 0.20mm/r |
| Recommended test board size | 320×350×460mm |
| Instrument Weight | 40Kg |
Pushen TQC Cupping Tester Packing list
host X1, manual X1, certificate X1, warranty card X1
[Note] Because the manufacturer's packaging may be updated or upgraded, the detailed packaging list shall be subject to the latest standard configuration of the manufacturer.
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