Rennes LN-90K wave soldering and reflow soldering special Furnace temperature tracker 9 channels 280 ℃ 10min
Number of channels 9 channels, Sampling rate 0.05 seconds -3600 seconds, Probe type K, Reliability, high performance price ratio, high accuracy, suitable for a variety of lead and lead-free solder reflow furnace/peak furnace temperature Linear dispersion test.
LeiEn
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Introduction
LN-90K Wave Soldering Reflow Soldering Furnace Temperature Tracker has superior thermal insulation performance that enables the test system to perform temperature mapping in harsh thermal environments. Together with the product, the temperature of the heat treatment furnace and the product can be tracked and monitored throughout the process. The LN-90K Wave Soldering Reflow Furnace Temperature Tracker is a reliable product with excellent thermal insulation and the ability to perform temperature mapping in harsh thermal environments. Used in conjunction with the heat treatment furnace, the temperature of the furnace and the product can be tracked and monitored from start to finish, allowing valuable data to be obtained without delaying the trial. By forming a curve analysis report, engineers can instantly understand the true temperature state of the product and furnace and get guidance on optimizing operations. By balancing temperature, time, and heating rates, users can increase line speed and product quality for efficient production.
Scope of application
It is suitable for temperature monitoring, soldering process adjustments and improvements in reflow and wave soldering processes. It has the characteristics of high reliability, high performance-to-price ratio and high precision. It is suitable for testing the temperature profile of a reflow oven/wave oven for a wide range of leaded and lead-free solders. Especially in wave soldering, the instrument is technologically advanced and can truly reflect the temperature of the wave soldering furnace. It is used for temperature monitoring, soldering process adjustments and improvements in the reflow wave soldering process. It has the characteristics of high reliability, high performance-to-price ratio and high precision. Suitable for a wide range of leaded and lead-free solder reflow ovens/Testing of the temperature profile of the wave furnace.It is used in SMT reflow soldering and wave soldering furnace temperature curve testing, especially in wave soldering, the instrument technology is advanced, and it can truly reflect the temperature of wave soldering furnace.
LeiEn LN-90K Furnace temperature tracker for wave soldering and reflow solderingSpecifications
| LIST | VALUE |
|---|---|
| number of channels | Channel 9 |
| Sampling rate | 0.05 seconds to 3600 seconds |
| Probe type | K |
| data transmission | data cable |
| continuous testing | 16 consecutive test storage |
| startup mode | button start, time start, temperature start |
| Instrument temperature resistance | 100℃ |
| Operating Voltage | 4.2v |
| Instrument power consumption | 20 mAh |
| Instrument size | 258*62*11mm |
| Computer requirements | Windows98, 2000, XP, win7, win8, win10, etc., can print out the temperature Linear dispersion through the computer. |
| Battery | Li-ion battery |
| Instrument Accuracy | +/- 0.5 ℃ (maximum error) |
| Resolution | 0.1℃ |
| Measurement range | -200 to 1370 ℃ |
| real-time testing | Connect to the computer to display the temperature in real time. |
| Memory Capacity | 512M |
| Battery level | 1200 mAh (70 hours of continuous recording) |
| Calibrated mode | Analog signal or temperature |
| Insulation box performance | 280 ℃ for 10 minutes |
| Insulation box size | 298*86*28mm |
LeiEn LN-90K Furnace temperature tracker for wave soldering and reflow soldering Packing list
Temperature recorder X1, special temperature measurement line X1, communication line X1, data download and analysis software X1, scissor X1, instrument box X1, certificate warranty card X1, instrument factory calibrated certificate X1, high temperature gloves X1, incubator X1, operation manual X1, high temperature tape X1
[Note] Because the manufacturer's packaging may be updated or upgraded, the detailed packaging list shall be subject to the latest standard configuration of the manufacturer.