This standard specifies requirements, test methods, inspection rules, marking, Encasement, transportation and storage of aluminum oxide ceramic substrates for thick film integrated circuits. It is suitable for the production and procurement of aluminum oxide ceramic substrates for chip components using thick film processes to ensure that their geometry and physical performance meet the needs of manufacturing and application.
This summary is not the original standard text and is for reference only. For accurate information, please obtain it through official channels.
| Status | Active | ||
|---|---|---|---|
| CCS | L90 | ICS | 31.030 |
| Release Date | 2013-11-12 00:00:00 | Implementation Date | 2014-04-15 00:00:00 |