This standard specifies in detail the requirements, test methods, inspection rules, and labeling, Encasement, transportation, storage, and order contents of gold-based thick-film conductor pastes. The scope of application includes gold-based thick-film conductor pastes for thick-film hybrid integrated circuits, Sensors, and other devices, referred to as gold pastes. A series of related documents are cited in the document, such as the test methods for precious metal pastes for thick-film microelectronics. In this standard, gold-based thick-film conductor pastes are defined as ultra-fine gold powder, ultra-fine palladium powder, inorganic additives, organic carriers, etc. A paste satisfied with printing or coating. The products are classified into conductor gold paste and welding gold paste according to the use, which are used for devices such as conduction bands and electrodes, as well as welding of Sensors electrode leads.