The standard "GB/T 17473.4-2008 Test Method for Determination of Adhesion of Precious Metal Pastes Used in Microelectronics Technology" specifies a method for determining the adhesion of precious metal pastes used in microelectronics technology. The method involves welding a copper wire to a ceramic substrate coated with a precious metal paste, and then pulling the copper wire vertically. The average force value required for pulling the lead wire is measured to evaluate the adhesion of the paste. The standard describes in detail the test materials, instrumentation and operation procedures, which are designed to ensure the Reliability and performance of precious metal pastes in microelectronic devices.