This standard specifies a method for measuring the curing temperature and heat of epoxy resin systems by using a differential scanning calorimeter (DSC). It is suitable for the curing reaction of epoxy resin systems in the range of 35 to 400 ° C, but not for systems containing blowing agents. The main points of the method include heating epoxy resin system samples at a certain heating rate in an inert atmosphere, recording the heat flow-temperature integral during the curing process. Linear dispersion is obtained from the curing starting temperature, peak temperature, curing end temperature and curing heat. The required instruments, instruments, and reagents include differential scanning calorimeter, quadrature meter, sample box, pressure sealer, Analytical Balance, nitrogen or argon, and high-purity indium, tin, lead, etc. The samples are taken from a well-mixed epoxy resin system without solvents, and two samples of each sample are taken with a mass of 5-10mg.