GB/T 43748-2024 "Microbeam Analysis, Transmission Electron Microscopy, Determination of the Thickness of Functional Film Layers in Integrated Circuit Chips" specifies a specific method for the use of Transmission Electron Microscope (EM)/Scanning Transmission Electron Microscope (EM) (TEM/STEM) measurement of the thickness of functional film layers in integrated circuit chips. This standard is applicable to the determination of functional film layers thicker than a few nanometers. It aims to provide an accurate, repeatability measurement technique to support the control and evaluation of functional layer thickness during integrated circuit manufacturing. The standard refers to a number of relevant documents, such as numerical revision rules, microbeam analysis terminology, nanotechnology terminology, etc., to ensure the accuracy and standardization of measurement processes and results, and to meet the requirements of the electronics industry for fine processing technology.