This standard specifies the test method for scale adhesion of oxygen-free copper materials. Scale adhesion refers to the adhesion strength of scales or similar substances on the surface of oxygen-free copper. It is a key indicator to evaluate the surface mass of copper materials and their performance during processing. The standard ensures the accuracy and conformity of adhesion testing by specifying specific test procedures and evaluation criteria. This method is widely used in the quality control and Product Research & Development of oxygen-free copper, especially in the fields of electrical and electronic materials with high requirements for material performance, providing an effective means of detection.