The JSA JIS C 60068-2-82 standard specifies a whisker test method for components and parts used in electronic assemblies (Test Xw1) for evaluating the tendency of whiskers to grow in tin or tin alloy coatings. Whiskers can cause short circuits or failures in electronic assemblies, so the standard provides a standardized test flow including specimen preparation, test environment (e.g. temperature, Humidity), and detection methods. Test methods are based on knowledge-driven development and are suitable for initial certification, periodic monitoring, and evaluation after technical or manufacturing process changes. The standard also applies to sub-suppliers such as Eletroplating, stamping, etc. to ensure conformity of surface mass in the supply chain.