GB/T 29847-2025 "Test Method for Copper Foil for Printed Circuit Boards" is a national standard applicable to the mass detection of copper foil for rigid and flexible printed circuit boards. It replaces the 2013 version and will be implemented on October 1, 2025. The standard specifies the key test items of copper foil Appearance, size, physical performance, process performance, covering thickness uniformity, surface roughness, tensile strength, elongation, corrosion resistance, thermal expansion coefficient and bending resistance. Compared with the old version, new content such as pinholing detection, laser asperity analysis, solvent peeling strength test, etc., while optimizing the sampling method and instrument accuracy requirements, deleting outdated items such as bending fatigue.