The GB/T 16998-1997 standard specifies the method for determining the thermal stability of hot-melt adhesives. The purpose of this standard is to evaluate the Stability and heat resistance of hot-melt adhesives under high temperature conditions. Through the specified test procedures, the heat resistance of hot-melt adhesives during use can be tested to ensure that their performance in high temperature environments is stable and meets practical application requirements.
This summary is not the original standard text and is for reference only. For accurate information, please obtain it through official channels.
| Status | Active | ||
|---|---|---|---|
| CCS | G38 | ICS | 83.180 |
| Release Date | 1997-09-26 00:00:00 | Implementation Date | 1998-04-01 00:00:00 |