This standard specifies the technical requirements for copper-clad phenolic paper laminates for printed circuits, including classification, materials, performance, test methods, mass assurance, Encasement, marking, transportation and storage. Copper-clad laminates are laminates dipped in phenolic resin from cellulose paper and then coated with copper foil on one or both sides. They are hot-pressed and formed. They are widely used in the manufacture of printed circuits. This standard is applicable to ensure the stability of the mass and performance of copper-clad laminates, so as to meet the needs of the field of electronic manufacturing. Important technical specifications related to printed circuit boards are also cited in the standard to ensure their Reliability and conformity in applications.