This standard specifies the terminology, classification, technical requirements, inspection rules, Encasement, storage and transportation of polyimide film copper clad panels for flexible printed circuits. It is suitable for the production and quality control of such film copper clad panels, providing a basis for the standardization of related products, and helping to improve the manufacturing mass and performance of flexible circuit boards.
This summary is not the original standard text and is for reference only. For accurate information, please obtain it through official channels.
| Status | Active | ||
|---|---|---|---|
| CCS | L30 | ICS | 31.180 |
| Release Date | 2017-12-29 00:00:00 | Implementation Date | 2019-01-01 00:00:00 |