This standard specifies the requirements, test methods, inspection rules, marking, Encasement, transportation and storage of aluminum oxide Pottery and porcelain substrates for thin film integrated circuits. It is applicable to aluminum oxide Pottery and porcelain substrates in the production and procurement of thin film integrated circuits, and can refer to the substrates for chip components using thin film processes.
This summary is not the original standard text and is for reference only. For accurate information, please obtain it through official channels.
| Status | Active | ||
|---|---|---|---|
| CCS | L90 | ICS | 31.030 |
| Release Date | 2013-11-12 00:00:00 | Implementation Date | 2014-04-15 00:00:00 |