The GB/T 30860-2014 standard specifies contact and non-contact profiling methods for surface roughness and cutting line marks of silicon wafers for solar cells. It is suitable for single crystal and polycrystalline silicon wafers processed by wire cutting process. The standard describes the basic principle of asperity measurement, measurement equipment and operating procedures in detail, and recommends the use of Ra, Rz, Rq and other parameters to characterize surface roughness. The standard provides a technical basis for the evaluation and control of the surface mass of silicon wafers for solar cells.