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      GB/T 40110-2021 stipulates the determination of element contamination on the surface of silicon wafers by total reflection X-ray fluorescence spectrometry (TXRF). The standard details the determination principle, instrumentation and equipment requirements, and specifies the pretreatment of silicon wafer samples, measurement operation procedures and data processing methods. With the high Sensitivity of TXRF, trace element contamination on the surface of silicon wafers can be accurately detected, providing key technical support for the semiconductor industry to control the mass of silicon wafers and improve the chip manufacturing process, ensuring that silicon wafers meet strict production standards.

      This summary is not the original standard text and is for reference only. For accurate information, please obtain it through official channels.
      Status Active
      CCS G04 ICS 71.040.40
      Release Date 2021-05-21 00:00:00 Implementation Date 2021-12-01 00:00:00
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