This standard specifies the test method for weldability and solder resistance of precious metal slurry for microelectronics technology. The weldability of the metal conductor film after sintering of the slurry is assessed by visually measuring the saturation degree of the metal conductor film after sintering by magnifying glass; the solder resistance is assessed according to the area change of the metal conductor film before and after etching in the molten solder. It is suitable for the welding performance evaluation of precious metal slurry in the field of microelectronics technology.
This summary is not the original standard text and is for reference only. For accurate information, please obtain it through official channels.
| Status | Active | ||
|---|---|---|---|
| CCS | H23 | ICS | 77.040.99 |
| Release Date | 2022-03-09 00:00:00 | Implementation Date | 2022-10-01 00:00:00 |