GB/T 4937.15 - 2018 for the test of solder heat resistance of semiconductor through-hole mounting devices. It specifies the scope of applicable devices and specifies in detail the test equipment for simulating solder heat, such as temperature-controlled heating devices. Standardize the test process, including setting key parameters such as the temperature and duration of solder heat, in order to inspect the tolerance of devices under high welding temperatures. The standard provides a basis for semiconductor device manufacturers to control product mass and electronic equipment manufacturers to evaluate the applicability of devices, ensure that through-hole mounting devices are not damaged during welding, and ensure the Stability and Reliability of electronic equipment assembly.