The GB/T 4722-2017 standard specifies the test method for rigid copper-clad laminates for printed circuits. This standard describes in detail the specific steps and requirements for testing the preparation, physical and mechanical properties of laminates. These tests include interlayer bond strength, bending performance, etc., and are suitable for evaluating the application performance and quality control of laminates in the manufacture of electronic products.
This summary is not the original standard text and is for reference only. For accurate information, please obtain it through official channels.
| Status | Active | ||
|---|---|---|---|
| CCS | L30 | ICS | 31.180 |
| Release Date | 2017-05-31 00:00:00 | Implementation Date | 2017-12-01 00:00:00 |