SETCAS SC-H-II Nitrogen Filling Roasting Machine (with jacking) Room Temperature -450 ℃

Introduction

The SC-H-II glue baking machine is equipped with a jack, can pass nitrogen, can be evacuated, and can be set to a rising curve. It is suitable for semiconductor silicon wafers, glass slides , wafers, substrates, ITO conductive glass and other processes. After the surface of the plate is coated, the film is dried and solidified. The Hot Plate has high temperature stability and good repeatability. Used for production, scientific research and teaching in industrial and mining enterprises, scientific research, education and other units.

Product main features

1. The stability performance is very good, and the temperature stability can reach ±0.5℃.

2. Wide temperature adjustment range: room temperature -450℃.

2. Adopt closed-loop control and heat up quickly.

3. With timing function. It also has a countdown display function.

4. Use digital buttons to control temperature and time, making temperature and time settings more accurate.

5. The body is all made of stainless steel, which is acid, alkali and corrosion resistant.

6. Provide Heating Plate customization services according to the size of the customer's substrate.

[Note] Because the manufacturer's packaging may be updated or upgraded, the detailed packaging list shall be subject to the latest standard configuration of the manufacturer.