Japan KETT LE-373 magnetic Induction film thickness meter 2500 μm large range, with LEP-J probe
LE-373 electromagnetic film thickness meter is an upgraded version of LE-370: the upgraded part is 3000 for Data storage, which is increased to 39,000; the data transmission speed is faster; the management software is upgraded.
KETT
LE-373
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LE-373 electromagnetic Film Thickness Gauge uses the principle of electromagnetic induction testing to non-destructively test non-magnetic coatings (such as paint, plastic, resin, rubber, enamel, zinc, chromium, tin, copper) on magnetic substrates (iron or steel) , aluminum, other) thickness. Test data can be imported into a computer or printed directly via an external printer.
The LE-373 electromagnetic Film Thickness Gauge is an upgraded version of the LE-370: the upgraded part is that the data storage capacity is increased from 3000 to 39000; the data transmission speed is faster; the management software is upgraded.
Test schematic
KETT LE-373 Film thickness meterSpecifications
| LIST | VALUE |
|---|---|
| Measurement principle | Magnetic Induction |
| Measurement range | 0~2500μm |
| margin of error | <50μm±1μm ≥50μm<1000μm±2% ≥1000μm±3% |
| Resolution | 0.1μm|1μm |
| probe | Line probe |
| statistical function | Measurement times, MAX Maximum, MIN Minimum, Average, Standard deviation |
| Power Supply | 1.5V |
| Display screen | Digital LCD display (backlight can be self-selected switch) |
| Interface | USB、RS-232C |
| Machine Weight | 0.34kg |
| Data storage | About 39,000 with a MIN Minimum of 0.1 μm |
| Interface | Computer (USB) output or printer (RS-232C) |
| Machine size | 75*145*31mm |
| Measurement area | Φ5㎜ |
| Operating temperature | 0~40℃ |
| Battery life | 100h |
| Power Consumption | 80mW (without backlight) |
| storage channel | 50 |
| probe | Touch (LEP-J) or (LHP-J) |
KETT LE-373 Film thickness meter Packing list
Substrate x1, standard sheet x1, alkaline battery x4, probe x1, leather case x1
[Note] Because the manufacturer's packaging may be updated or upgraded, the detailed packaging list shall be subject to the latest standard configuration of the manufacturer.
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